AMD Phenom II Dual-Core Mobile N660 - HMN660DCR23GM information

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Type:CPU	Manufacturer:AMD
family:Phenom II Dual-Core Mobile	microprocessors:AMD Phenom II Dual-Core Mobile N660 - HMN660DCR23GM

Type	CPU / Microprocessor
Market segment	Mobile
Family	AMD Phenom II Dual-Core Mobile
Model number	N660
CPU part number	HMN660DCR23GM is an OEM/tray microprocessor
Stepping codes	AAEKC AE NAEKC AE
Frequency	3000 MHz
Bus speed	One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier	15
Package	638-pin lidless organic micro Pin Grid Array (UOL638)
AMD Package number	30600
Socket	Socket S1 (S1g4)
Size	1.38" x 1.38" / 3.5cm x 3.5cm
Weight	0.2oz / 5.6g (measured) 0.2oz / 6.5g (by specifications)
Introduction date	Jan 4, 2011
End-of-Life date	Last order date is end of 3rd quarter 2011 Last shipment date is end of 1st quarter 2012
Architecture / Microarchitecture
Microarchitecture	K10
Platform	Danube
Processor core	Champlain
Core stepping	DA-C3
CPUID	100F63
Manufacturing process	0.045 micron silicon-on-insulator (SOI) technology
Data width	64 bit
The number of cores	2
The number of threads	2
Floating Point Unit	Integrated, 128-bit wide
Level 1 cache size	2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data caches
Level 2 cache size	2 x 1 MB 16-way set associative caches
Level 3 cache size	None
Multiprocessing	Uniprocessor
Features	MMX instructions Extensions to MMX 3DNow! technology Extensions to 3DNow! SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSE4a AMD64 / AMD 64-bit technology EVP / Enhanced Virus Protection AMD-V / AMD Virtualization technology
Low power features	PowerNow!
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1333, DDR3L-1066 Maximum memory bandwidth (GB/s): 21.3
Other peripherals	HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power	35 Watt

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