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AMD Mobile Sempron 3100+ - SMS3100BQX3LF information
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Type:CPU
Manufacturer:AMD
family:Mobile Sempron
microprocessors:AMD Mobile Sempron 3100+ - SMS3100BQX3LF
Type
CPU / Microprocessor
Market segment
Mobile
Family
AMD Mobile Sempron
Model number
3100+
CPU part number
SMS3100BQX3LF
is an OEM/tray microprocessor
Stepping codes
CBBWE CEBDE
Frequency
3100+ (rated)
1800 MHz (real)
Clock multiplier
9
Package
754-pin lidless organic micro-PGA
Socket
Socket 754
Architecture / Microarchitecture
Microarchitecture
K8
Processor core
Roma
Core stepping
DH-E6
CPUID
20FC2
Manufacturing process
0.09 micron
The number of cores
1
The number of threads
1
Floating Point Unit
Integrated
Level 1 cache size
64 KB instruction cache
64 KB data cache
Level 2 cache size
256 KB
Multiprocessing
Uniprocessor
Features
MMX instructions
3DNow! technology
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
EVP / Enhanced Virus Protection
Low power features
PowerNow! technology
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 1
Supported memory: DDR
Other peripherals
One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical / Thermal parameters
V core
1.2V
Maximum operating temperature
95°C
Thermal Design Power
25 Watt
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